SNOSAZ6C August   2008  – November 2015 LMV831 , LMV832 , LMV834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, 3.3 V
    6. 6.6 Electrical Characteristics, 5 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Characteristics
      2. 7.3.2 EMIRR
      3. 7.3.3 EMIRR Definition
        1. 7.3.3.1 Coupling an RF Signal to the IN+ Pin
        2. 7.3.3.2 Cell Phone Call
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Characteristics
      2. 7.4.2 CMRR Measurement
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LMV831 LMV832 LMV834 UNIT
DCK (SC70) DGK (VSSOP) PW (TSSOP)
5 PINS 8 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance (2) 267.7 177.1 118.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 96.6 67.1 44.4 °C/W
RθJB Junction-to-board thermal resistance 48.8 97.5 60.5 °C/W
ψJT Junction-to-top characterization parameter 2.5 9.9 4.5 °C/W
ψJB Junction-to-board characterization parameter 47.9 96.1 59.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.