SNVS159H October   2001  – July 2015 LP3981

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On/Off Input Operation
      2. 8.3.2 Fast On-Time
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VOUT(TARGET) + 0.3 V ≤ VIN ≤ 6 V
      2. 8.4.2 Operation With EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Dissipation and Device Operation
        2. 9.2.2.2 External Capacitors
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
        5. 9.2.2.5 No-Load Stability
        6. 9.2.2.6 Noise Bypass Capacitor
        7. 9.2.2.7 Capacitor Characteristics
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (May 2013) to H Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Rating table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Update pin names to TI nomenclature Go
  • Deleted Ordering Information table - duplicative of POAGo
  • Deleted Lead temperature spec from Abs Max table - it is in POA. Go
  • Deleted rows for max power dissipation - info in Power Dissipation and Device OperationGo
  • Deleted rows for max power dissipation - info in Power Dissipation and Device OperationGo
  • Added 2 new paragraphs to Power Dissipation and Device Operation subsection.Go

Changes from F Revision (May 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo