SNVS440B May   2007  – March 2016 LP5520

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  RGB Driver Electrical Characteristics (ROUT, GOUT, BOUT Outputs)
    7. 6.7  Logic Interface Characteristics
    8. 6.8  Magnetic Boost DC-DC Converter Electrical Characteristics
    9. 6.9  I2C Timing Parameters
    10. 6.10 SPI Timing Requirements
    11. 6.11 Typical Characteristics
      1. 6.11.1 RGB Driver Typical Characteristics
      2. 6.11.2 Boost Converter Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Start-Up Powering
      2. 7.3.2 RGB Driver Functionality
        1. 7.3.2.1 White Balance Control
        2. 7.3.2.2 LED Brightness Control
        3. 7.3.2.3 LED PWM Control
        4. 7.3.2.4 Sequential Mode
        5. 7.3.2.5 Current Control of the LEDs
        6. 7.3.2.6 Output Enables
        7. 7.3.2.7 Fade In and Fade Out
        8. 7.3.2.8 Temperature and Light Measurement
      3. 7.3.3 Magnetic High-Voltage Boost DC-DC Converter
        1. 7.3.3.1 Boost Control
        2. 7.3.3.2 Adaptive Output Voltage Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Manual Mode
      2. 7.4.2 Automatic Mode
      3. 7.4.3 Stand-Alone Mode
      4. 7.4.4 Start-Up Sequence
    5. 7.5 Programming
      1. 7.5.1 Control Interface
        1. 7.5.1.1 I2C Compatible Interface
          1. 7.5.1.1.1 I2C Signals
          2. 7.5.1.1.2 I2C Data Validity
          3. 7.5.1.1.3 I2C Start and Stop Conditions
          4. 7.5.1.1.4 Transferring Data
        2. 7.5.1.2 SPI Interface
          1. 7.5.1.2.1 SPI Incremental Addressing
      2. 7.5.2 EEPROM Memory
    6. 7.6 Register Maps
      1. 7.6.1 LP5520 Registers, Control Bits, and Default Values
        1. 7.6.1.1 Register Bit Conventions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application: I2C-Bus Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Recommended External Components
            1. 8.2.1.2.1.1 Output Capacitor: COUT
            2. 8.2.1.2.1.2 Input Capacitor: CIN
            3. 8.2.1.2.1.3 Output Diode: DOUT
            4. 8.2.1.2.1.4 EMI Filter Components: CSW, RSW, LSW And CHF
            5. 8.2.1.2.1.5 Inductor: L1
            6. 8.2.1.2.1.6 List Of Recommended External Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Stand-Alone Typical Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.