SNVSCC4 October   2023 LP5811

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
      2. 9.3.2 Analog Dimming
      3. 9.3.3 PWM Dimming
      4. 9.3.4 Autonomous Animation Engine Control
        1. 9.3.4.1 Animation Engine Pattern
        2. 9.3.4.2 Sloper
        3. 9.3.4.3 Animation Engine Unit (AEU)
        4. 9.3.4.4 Animation Pause Unit (APU)
      5. 9.3.5 Protections and Diagnostics
        1. 9.3.5.1 Overvoltage Protection
        2. 9.3.5.2 Output Short-to-Ground Protection
        3. 9.3.5.3 LED Open Detections
        4. 9.3.5.4 LED Short Detections
        5. 9.3.5.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Maps
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-20211221-SS0I-WCPG-WG0C-VVCTN5SGQBJN-low.svg Figure 6-1 LP5811 YBH Package 12-Pin DSBGA Top View
GUID-20220807-SS0I-RJJM-D3BX-GG25H2GCDKJZ-low.svg Figure 6-2 LP5811 DRR Package 12-Pin WSON Top View
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME YBH DRR
EN A1 11 I Enable signal for the integrated boost converter.
VIN A2 12 P Power supply of the boost converter.
SW A3 1 P Switch pin of the integrated boost converter, which connects to the drain of low-side power FET and source of high-side rectifier FET. Connecting the inductor to this pin.
OUT0 B1 10 O Current sink 0. If not used, this pin must be floating.
GND B2 3 G Ground. This pin must connect to the ground plane.
VOUT B3 2 P Boost converter output and power supply of the LED driver blocks. Connect to external power supply directly if need to bypass the boost converter.
OUT1 C1 9 O Current sink 1. If not used, this pin must be floating.
SYNC C2 4 I/O Clock synchronous among multiple devices. If not used, this pin can connect to ground to save power.
SCL C3 5 I I2C serial interface clock input.
OUT2 D1 8 O Current sink 2. If not used, this pin must be floating.
OUT3 D2 7 O Current sink 3. If not used, this pin must be floating.
SDA D3 6 I/O I2C serial interface data input/output.
(1) G: Ground Pin; P: Power Pin; I: Input Pin; I/O: Input/Output Pin; O: Output Pin.