SNVS798Q April   2012  – July 2025 LP5907

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Output and Input Capacitors
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Low Output Noise
      3. 6.3.3 Output Automatic Discharge
      4. 6.3.4 Remote Output Capacitor Placement
      5. 6.3.5 Thermal Overload Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable (EN)
      2. 6.4.2 Minimum Operating Input Voltage (VIN)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Power Dissipation and Device Operation
        3. 7.2.2.3 External Capacitors
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Capacitor Characteristics
        7. 7.2.2.7 Remote Capacitor Operation
        8. 7.2.2.8 No-Load Stability
        9. 7.2.2.9 Enable Control
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 X2SON Mounting
        2. 7.4.1.2 DSBGA Mounting
        3. 7.4.1.3 DSBGA Light Sensitivity
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Custom Design With WEBENCH® Tools
      2. 8.1.2 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YKM|4
  • DBV|5
  • DQN|4
  • YKG|4
  • YKE|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

VIN = VOUT(NOM) + 1V, VEN = 1.2V, IOUT = 1mA, CIN = 1µF, and COUT = 1µF (unless otherwise noted)(1)(2)(3)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VINInput voltageTA = 25°C2.25.5V
ΔVOUTOutput voltage toleranceVIN = (VOUT(NOM) + 1V) to 5.5V,
IOUT = 1mA to 250mA		–22%VOUT
VIN = (VOUT(NOM) + 1V) to 5.5V,
IOUT = 1mA to 250mA
(VOUT < 1.8V, SOT-23, X2SON packages)		–33
Line regulationVIN = (VOUT(NOM) + 1V) to 5.5V,
IOUT = 1mA		0.02%/V
Load regulationIOUT = 1mA to 250mA0.001%/mA
ILOADLoad currentSee(4)0250mA
Maximum output current250 mA
IQQuiescent current(5)VEN = 1.2V, IOUT = 0mA1225μA
VEN = 1.2V, IOUT = 250mA250425
VEN = 0.3V (disabled)0.21
IGGround current(6)VEN = 1.2V, IOUT = 0mA14μA
VDODropout voltage(7)IOUT = 100mA50mV
IOUT = 250mA (DSBGA package)120200
IOUT = 250mA (SOT-23, X2SON packages)250
ISCShort-circuit current limitTA = 25°C(8)250500mA
PSRR Power-supply rejection ratio(9) f = 100Hz, IOUT = 20mA 90 dB
f = 1kHz, IOUT = 20mA82
f = 10kHz, IOUT = 20mA65
f = 100kHz, IOUT = 20mA60
eNOutput noise voltage(9)BW = 10Hz to 100kHzIOUT = 1mA10µVRMS
IOUT = 250mA6.5
RADOutput automatic discharge pulldown resistanceVEN < VIL (output disabled)230Ω
TSDThermal shutdownTJ rising160°C
Thermal hysteresisTJ falling from shutdown15
LOGIC INPUT THRESHOLDS
VILLow input thresholdVIN = 2.2V to 5.5V,
VEN falling until the output is disabled		0.4V
VIHHigh input thresholdVIN = 2.2V to 5.5V
VEN rising until the output is enabled		1.2V
IENInput current at EN pin(10)VEN = 5.5V and VIN = 5.5V5.5μA
VEN = 0V and VIN = 5.5V0.001
TRANSIENT CHARACTERISTICS
ΔVOUTLine transient(9)VIN = (VOUT(NOM) + 1V) to
(VOUT(NOM) + 1.6V) in 30µs		–1mV
VIN = (VOUT(NOM) + 1.6V) to
(VOUT(NOM) + 1.6V) in 30µs		1
Load transient(9)IOUT = 1mA to 250mA in 10µs–40
IOUT = 250mA to 1mA in 10µs40
Overshoot on start-up(9)Stated as a percentage of VOUT(NOM)5%
Overshoot on start-up with EN(9)Stated as a percentage of VOUT(NOM), VIN = VOUT + 1V to 5.5V, 0.7µF < COUT < 10µF, 0mA < IOUT < 250mA, EN rising until the output is enabled1%
tONTurn-on timeFrom VEN > VIH to VOUT = 95% of VOUT(NOM),
TA = 25°C		80150µs
(1) All voltages are with respect to the device GND terminal, unless otherwise stated.
(2) Minimum and maximum limits are specified through test, design, or statistical correlation over the junction temperature (TJ) range of –40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for reference purposes only.
(3) In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature can possibly have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the device or package in the application RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See the Application and Implementation section.
(4) The device maintains a stable, regulated output voltage without a load current.
(5) Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.
(6) Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.
(7) Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100mV below the nominal value.
(8) Short-circuit current (ISC) for the LP5907 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured with VOUT pulled to 100mV below the nominal voltage.
(9) This specification is verified by design.
(10) There is a 1MΩ resistor between EN and ground on the device.