SNVS693E September   2011  – September 2014 LP8552

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Default EEPROM Values
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Boost Converter Electrical Characteristics
    7. 7.7  LED Driver Electrical Characteristics
    8. 7.8  PWM Interface Characteristics
    9. 7.9  Undervoltage Protection
    10. 7.10 Logic Interface Characteristics
    11. 7.11 I2C Serial Bus Timing Parameters (SDA, SCLK)
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Generation
      2. 8.3.2 Brightness Control Methods
        1. 8.3.2.1  PWM Input Duty Cycle
        2. 8.3.2.2  Brightness Register Control
        3. 8.3.2.3  PWM Direct Control
        4. 8.3.2.4  PWM Calculation Data Flow
        5. 8.3.2.5  PWM Detector
        6. 8.3.2.6  Brightness Control
        7. 8.3.2.7  Resolution Selector
        8. 8.3.2.8  Sloper
        9. 8.3.2.9  PWM & Current Control
        10. 8.3.2.10 Dither
        11. 8.3.2.11 PWM Comparator
        12. 8.3.2.12 Current Setting
        13. 8.3.2.13 PWM Frequency Setting
        14. 8.3.2.14 Phase Shift PWM Scheme
        15. 8.3.2.15 Slope And Dithering
        16. 8.3.2.16 Driver Headroom Control
      3. 8.3.3 Boost Converter
        1. 8.3.3.1 Operation
        2. 8.3.3.2 Protection
        3. 8.3.3.3 Manual Output Voltage Control
        4. 8.3.3.4 Adaptive Boost Control
      4. 8.3.4 Fault Detection
        1. 8.3.4.1 LED Fault Detection
        2. 8.3.4.2 Undervoltage Detection
        3. 8.3.4.3 Overcurrent Protection
        4. 8.3.4.4 Device Thermal Regulation
        5. 8.3.4.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Serial Bus Interface
        1. 8.5.1.1 Interface Bus Overview
        2. 8.5.1.2 Data Transactions
        3. 8.5.1.3 Acknowledge Cycle
        4. 8.5.1.4 “Acknowledge After Every Byte” Rule
        5. 8.5.1.5 Addressing Transfer Formats
        6. 8.5.1.6 Control Register Write Cycle
        7. 8.5.1.7 Control Register Read Cycle
      2. 8.5.2 EEPROM
    6. 8.6 Register Maps
      1. 8.6.1 Register Bit Explanations
        1. 8.6.1.1 Brightness Control
        2. 8.6.1.2 Device Control
        3. 8.6.1.3 Fault
        4. 8.6.1.4 Identification
        5. 8.6.1.5 Direct Control
        6. 8.6.1.6 Temp MSB
        7. 8.6.1.7 Temp LSB
        8. 8.6.1.8 EEPROM Control
      2. 8.6.2 EEPROM Bit Explanations
        1. 8.6.2.1 EEPROM Address 0
        2. 8.6.2.2 EEPROM Address 1
        3. 8.6.2.3 EEPROM Address 2
        4. 8.6.2.4 EEPROM Address 3
        5. 8.6.2.5 EEPROM Address 4
        6. 8.6.2.6 EEPROM Address 5
        7. 8.6.2.7 EEPROM Address 6
        8. 8.6.2.8 EEPROM Address 7
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application Using Internal LDO
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor
          3. 9.2.1.2.3 LDO Capacitor
          4. 9.2.1.2.4 Output Diode
          5. 9.2.1.2.5 Resistors for Setting the LED Current and PWM Frequency
          6. 9.2.1.2.6 Filter Component Values
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Typical Application for Low Input Voltage
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Typical Application for Three Channels and Low Input Voltage
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DSBGA (YZR)
25
Top View
30138175.gif
DSBGA (YZR)
25
Bottom View
30138172.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NUMBER NAME
A1 GND_SW G Boost switch ground
A2 GND_SW G Boost switch ground
A3 EN I Enable input pin
A4 PWM A PWM dimming input. This pin must be connected to GND if not used.
A5 FB A Boost feedback input
B1 SW A Boost switch
B2 SW A Boost switch
B3 ISET A Set resistor for LED current. This pin can be left floating if not used.
B4 FSET A PWM frequency set resistor. This pin can be left floating if not used.
B5 GND_S G Signal ground
C1 VIN P Input power supply up to 22 V. If 2.7 V ≤ VBATT < 5.5 V (Figure 31) then external 5-V rail must be used for VLDO and VIN.
C2 FILTER A Low pass filter for PLL. This pin can be left floating if not used.
C3 FAULT OD Fault indication output. If not used, can be left floating.
C4 VDDIO P Digital IO reference voltage (1.65 V to 5 V) for I2C interface and PWM input.
C5 OUT3 A Current sink output
D1 VLDO P LDO output voltage. External 5-V rail can be connected to this pin in low voltage application.
D2 VSYNC I VSYNC input. This pin must be connected to GND if not used.
D3 SCLK I Serial clock. This pin must be connected to GND if not used.
D4 SDA I/O Serial data. This pin must be connected to GND if not used.
D5 OUT2 A Current sink output
E1 OUT6 A Current sink output
E2 OUT5 A Current sink output
E3 OUT4 A Current sink output
E4 GND_L G LED ground
E5 OUT1 A Current sink output
(1) A: Analog Pin, G: Ground Pin, P: Power Pin, I: Input Pin, I/O: Input/Output Pin, O: Output Pin, OD: Open Drain Pin