SNVS693E September   2011  – September 2014 LP8552

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Default EEPROM Values
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Boost Converter Electrical Characteristics
    7. 7.7  LED Driver Electrical Characteristics
    8. 7.8  PWM Interface Characteristics
    9. 7.9  Undervoltage Protection
    10. 7.10 Logic Interface Characteristics
    11. 7.11 I2C Serial Bus Timing Parameters (SDA, SCLK)
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Generation
      2. 8.3.2 Brightness Control Methods
        1. 8.3.2.1  PWM Input Duty Cycle
        2. 8.3.2.2  Brightness Register Control
        3. 8.3.2.3  PWM Direct Control
        4. 8.3.2.4  PWM Calculation Data Flow
        5. 8.3.2.5  PWM Detector
        6. 8.3.2.6  Brightness Control
        7. 8.3.2.7  Resolution Selector
        8. 8.3.2.8  Sloper
        9. 8.3.2.9  PWM & Current Control
        10. 8.3.2.10 Dither
        11. 8.3.2.11 PWM Comparator
        12. 8.3.2.12 Current Setting
        13. 8.3.2.13 PWM Frequency Setting
        14. 8.3.2.14 Phase Shift PWM Scheme
        15. 8.3.2.15 Slope And Dithering
        16. 8.3.2.16 Driver Headroom Control
      3. 8.3.3 Boost Converter
        1. 8.3.3.1 Operation
        2. 8.3.3.2 Protection
        3. 8.3.3.3 Manual Output Voltage Control
        4. 8.3.3.4 Adaptive Boost Control
      4. 8.3.4 Fault Detection
        1. 8.3.4.1 LED Fault Detection
        2. 8.3.4.2 Undervoltage Detection
        3. 8.3.4.3 Overcurrent Protection
        4. 8.3.4.4 Device Thermal Regulation
        5. 8.3.4.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Serial Bus Interface
        1. 8.5.1.1 Interface Bus Overview
        2. 8.5.1.2 Data Transactions
        3. 8.5.1.3 Acknowledge Cycle
        4. 8.5.1.4 “Acknowledge After Every Byte” Rule
        5. 8.5.1.5 Addressing Transfer Formats
        6. 8.5.1.6 Control Register Write Cycle
        7. 8.5.1.7 Control Register Read Cycle
      2. 8.5.2 EEPROM
    6. 8.6 Register Maps
      1. 8.6.1 Register Bit Explanations
        1. 8.6.1.1 Brightness Control
        2. 8.6.1.2 Device Control
        3. 8.6.1.3 Fault
        4. 8.6.1.4 Identification
        5. 8.6.1.5 Direct Control
        6. 8.6.1.6 Temp MSB
        7. 8.6.1.7 Temp LSB
        8. 8.6.1.8 EEPROM Control
      2. 8.6.2 EEPROM Bit Explanations
        1. 8.6.2.1 EEPROM Address 0
        2. 8.6.2.2 EEPROM Address 1
        3. 8.6.2.3 EEPROM Address 2
        4. 8.6.2.4 EEPROM Address 3
        5. 8.6.2.5 EEPROM Address 4
        6. 8.6.2.6 EEPROM Address 5
        7. 8.6.2.7 EEPROM Address 6
        8. 8.6.2.8 EEPROM Address 7
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application Using Internal LDO
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor
          3. 9.2.1.2.3 LDO Capacitor
          4. 9.2.1.2.4 Output Diode
          5. 9.2.1.2.5 Resistors for Setting the LED Current and PWM Frequency
          6. 9.2.1.2.6 Filter Component Values
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Typical Application for Low Input Voltage
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Typical Application for Three Channels and Low Input Voltage
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (January 2014) to E Revision

  • Added Device Information andHandling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section. Go

Changes from C Revision (March 2013) to D Revision

  • Added note re EEPROMGo
  • Added add note re: EEPROM configurationGo