SNVSBP2 February   2020 LP8758-E3

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
        1. 7.1.1.1 Operating Modes
        2. 7.1.1.2 Programmability
        3. 7.1.1.3 Features
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overview
        1. 7.3.1.1 Transition between PWM and PFM Modes
        2. 7.3.1.2 Buck Converter Load Current Measurement
        3. 7.3.1.3 Spread-Spectrum Mode
      2. 7.3.2 Power-Up
      3. 7.3.3 Regulator Control
        1. 7.3.3.1 Enabling and Disabling
        2. 7.3.3.2 Changing Output Voltage
      4. 7.3.4 Device Reset Scenarios
      5. 7.3.5 Diagnosis and Protection Features
        1. 7.3.5.1 Warnings for Diagnosis (Interrupt)
          1. 7.3.5.1.1 Output Current Limit
          2. 7.3.5.1.2 Thermal Warning
        2. 7.3.5.2 Protection (Regulator Disable)
          1. 7.3.5.2.1 Short-Circuit and Overload Protection
          2. 7.3.5.2.2 Thermal Shutdown
        3. 7.3.5.3 Fault (Power Down)
          1. 7.3.5.3.1 Undervoltage Lockout
      6. 7.3.6 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  OTP_REV
        2. 7.6.1.2  BUCK0_CTRL1
        3. 7.6.1.3  BUCK0_CTRL2
        4. 7.6.1.4  BUCK1_CTRL1
        5. 7.6.1.5  BUCK1_CTRL2
        6. 7.6.1.6  BUCK2_CTRL1
        7. 7.6.1.7  BUCK2_CTRL2
        8. 7.6.1.8  BUCK3_CTRL1
        9. 7.6.1.9  BUCK3_CTRL2
        10. 7.6.1.10 BUCK0_VOUT
        11. 7.6.1.11 BUCK0_FLOOR_VOUT
        12. 7.6.1.12 BUCK1_VOUT
        13. 7.6.1.13 BUCK1_FLOOR_VOUT
        14. 7.6.1.14 BUCK2_VOUT
        15. 7.6.1.15 BUCK2_FLOOR_VOUT
        16. 7.6.1.16 BUCK3_VOUT
        17. 7.6.1.17 BUCK3_FLOOR_VOUT
        18. 7.6.1.18 BUCK0_DELAY
        19. 7.6.1.19 BUCK1_DELAY
        20. 7.6.1.20 BUCK2_DELAY
        21. 7.6.1.21 BUCK3_DELAY
        22. 7.6.1.22 RESET
        23. 7.6.1.23 CONFIG
        24. 7.6.1.24 INT_TOP
        25. 7.6.1.25 INT_BUCK_0_1
        26. 7.6.1.26 INT_BUCK_2_3
        27. 7.6.1.27 TOP_STAT
        28. 7.6.1.28 BUCK_0_1_STAT
        29. 7.6.1.29 BUCK_2_3_STAT
        30. 7.6.1.30 TOP_MASK
        31. 7.6.1.31 BUCK_0_1_MASK
        32. 7.6.1.32 BUCK_2_3_MASK
        33. 7.6.1.33 SEL_I_LOAD
        34. 7.6.1.34 I_LOAD_2
        35. 7.6.1.35 I_LOAD_1
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Input Capacitor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

YFF Package
35-Pin DSBGA
Top View
LP8758-E3 ballmap_58_top.gif
YFF Package
35-Pin DSBGA
Bottom View
LP8758-E3 ballmap_58_bottom.gif

Pin Functions

PIN TYPE DESCRIPTION
NUMBER NAME
A1, B1 VIN_B1 P Input for Buck1. The separate power pins VIN_Bx are not connected together internally – VIN_Bx pins must be connected together in the application and be locally bypassed.
A2, B2 SW_B1 A Buck1 switch node.
A3, B3, C3 PGND_B01 G Power Ground for Buck0 and Buck1.
A4, B4 SW_B0 A Buck0 switch node.
A5, B5 VIN_B0 P Input for Buck0. The separate power pins VIN_Bx are not connected together internally – VIN_Bx pins must be connected together in the application and be locally bypassed.
C1 SGND G Substrate Ground.
C2 FB_B1 A Output voltage feedback for Buck1.
C4 FB_B0 A Output voltage feedback for Buck0.
C5 EN1 D/I Programmable Enable signal for Buck converter core or cores. Can be also configured to switch between two output voltage levels.
D1 AGND G Ground.
D2 nINT D/O Open-drain interrupt output. Active LOW.
D3 EN2 D/I Programmable Enable signal for Buck converter one or more cores. Can be also configured to switch between two output voltage levels.
D4 NRST D/I Reset signal for the device. Can be also used to enable the regulator.
D5 SDA D/I/O Serial interface data input and output for system access. Connect a pullup resistor.
E1 VANA P Supply voltage for Analog and Digital blocks.
E2 FB_B3 A Output voltage feedback for Buck3.
E4 FB_B2 A Output voltage feedback for Buck2.
E5 SCL D/I Serial interface clock input for system access. Connect a pullup resistor.
F1, G1 VIN_B3 P Input for Buck3. The separate power pins VIN_Bx are not connected together internally – VIN_Bx pins must be connected together in the application and be locally bypassed.
F2, G2 SW_B3 A Buck3 switch node.
E3, F3, G3 PGND_B23 G Power Ground for Buck2 and Buck3.
F4, G4 SW_B2 A Buck2 switch node.
F5, G5 VIN_B2 P Input for Buck2. The separate power pins VIN_Bx are not connected together internally - VIN_Bx pins must be connected together in the application and be locally bypassed.
A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin