SLVSCP5H July   2014  – April 2021 LSF0204 , LSF0204D

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.8 V)
    7. 7.7  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.2 V)
    8. 7.8  Switching Characteristics: AC Performance (Translating Up, 1.8 V to 3.3 V)
    9. 7.9  Switching Characteristics: AC Performance (Translating Up, 1.2 V to 1.8 V)
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit AC Waveform for Outputs
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Support High Speed Translation, Greater than 100 MHz
      2. 9.3.2 Bidirectional Voltage Translation Without DIR Terminal
      3. 9.3.3 5-V Tolerance on IO Port and 125°C Support
      4. 9.3.4 Channel Specific Translation
      5. 9.3.5 Ioff, Partial Power Down Mode
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 I2C PMBus, SMBus, GPIO, Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Bidirectional Translation
            1. 10.2.1.2.1.1 Pull-Up Resistor Sizing
          2. 10.2.1.2.2 LS Family Bandwidth
        3. 10.2.1.3 Application Curve
      2. 10.2.2 MDIO Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Multiple Voltage Translation in Single Device, Application
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
  • YZP|12
  • RUT|12
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (November 2019) to Revision H (April 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Bidirectional Translation section to include inclusive terminologyGo

Changes from Revision F (January 2019) to Revision G (November 2019)

  • Changed Vref_A/B/EN max voltage to 5.5 V in the Recommended Operating Conditions tableGo

Changes from Revision E (December 2018) to Revision F (January 2019)

  • Changed location of YZP-package indicator dot to A3 position. Go
  • Added YZP package to Thermal Information tableGo

Changes from Revision D (December 2015) to Revision E (December 2018)

  • Changed location of YZP-package A1-pin indicator dot. View is looking through the device, as in an X-ray. Go

Changes from Revision C (August 2015) to Revision D (December 2015)

  • Added Type Column to Pin Functions tableGo
  • Added Junction Temperatures to Thermal Information tableGo

Changes from Revision B (April 2015) to Revision C (August 2015)

  • Removed bullet "Less than 1.5 ns max propagation delay" from Features.Go
  • Updated "Supports High Speed Translation, Greater Than 100 MHz" bullet in Features.Go

Changes from Revision A (December 2014) to Revision B (April 2015)

  • Added YZP package to device. Go

Changes from Revision * (November 2014) to Revision A (December 2014)

  • Changed From a first page Product Preview To a full datasheet Go
  • Changed text in the Section 3 From: "transmission speeds greater than 100 Mbps" To: "transmission speeds greater than 100 MHz" Go