SNVSAZ1A August   2017  – September 2020 LV14360

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Control
      2. 8.3.2  Slope Compensation
      3. 8.3.3  Sleep Mode
      4. 8.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 8.3.5  Adjustable Output Voltage
      6. 8.3.6  Enable and Adjustable Undervoltage Lockout
      7. 8.3.7  External Soft Start
      8. 8.3.8  Switching Frequency and Synchronization (RT/SYNC)
      9. 8.3.9  Power Good (PGOOD)
      10. 8.3.10 Overcurrent and Short-Circuit Protection
      11. 8.3.11 Overvoltage Protection
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light Load Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Set-Point
        2. 9.2.2.2 Switching Frequency
        3. 9.2.2.3 Output Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Schottky Diode Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Bootstrap Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Glossary
    5. 12.5 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Layout is a critical portion of good power supply design. The following guidelines will help users design a PCB with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI.

  1. The feedback network, resistor RFBT and RFBB, should be kept close to the FB pin. VOUT sense path away from noisy nodes and preferably through a layer on the other side of a shielding layer.
  2. The input bypass capacitor CIN must be placed as close as possible to the VIN pin and ground. Grounding for both the input and output capacitors should consist of localized top side planes that connect to the GND pin and PAD.
  3. The inductor L should be placed close to the SW pin to reduce magnetic and electrostatic noise.
  4. Place the output capacitor, COUT close to the junction of L and the diode D. Keep the L, D, and COUT trace as short as possible to reduce conducted and radiated noise and increase overall efficiency.
  5. The ground connection for the diode, CIN, and COUT should be as small as possible and tied to the system ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane.
  6. For more detail on switching power supply layout considerations see AN-1149 Layout Guidelines for Switching Power Supplies.