SLLS686E October   2005  – December 2024 MAX3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics: Driver
    8. 5.8  Electrical Characteristics: Receiver
    9. 5.9  Electrical Characteristics: Auto-Power Down
    10. 5.10 Switching Characteristics: Driver
    11. 5.11 Switching Characteristics: Receiver
    12. 5.12 Switching Characteristics: Auto-Power Down
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS-232 Driver
      3. 7.3.3 RS-232 Receiver
      4. 7.3.4 RS-232 Status
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1)MAX3221EUNIT
DB (SSOP)PW (TSSOP)DYY
(SOT-23-THN)
16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance105.8110.9

120.0

°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.941.7

56.8

°C/W
RθJBJunction-to-board thermal resistance57.657.2

51.3

°C/W
ψJTJunction-to-top characterization parameter14.14.2

2.6

°C/W
ψJBJunction-to-board characterization parameter56.856.6

50.9

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.