SLLS664E August   2005  – June 2021 MAX3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions (1)
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics — Device (1)
    7. 6.7  Electrical Characteristics — Driver (1)
    8. 6.8  Electrical Characteristics — Receiver (1)
    9. 6.9  Switching Characteristics (1)
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2017) to Revision E (June 2021)

  • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computingGo
  • Added the ESD Ratings - IEC Specifications table. Added a table note about 1-uF capacitor requirement between VCC and GND for D, DB and PW packages.Go
  • Changed the thermal parameter values for D, DB and PW packages in the Thermal Information table.Go

Changes from Revision C (June 2015) to Revision D (May 2017)

  • Changed 3 V ± 5.5 V to 3 V to 5.5 V in the VCC column of Table 9-1 Go

Changes from Revision B (December 2013) to Revision C (May 2015)

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision A (April 2007) to Revision B (December 2013)

  • Updated document to new TI data sheet format.Go
  • Deleted Ordering Information table.Go
  • Added Thermal Information table.Go