SLAS639L July   2011  – December 2017 MSP430FR5730 , MSP430FR5731 , MSP430FR5732 , MSP430FR5733 , MSP430FR5734 , MSP430FR5735 , MSP430FR5736 , MSP430FR5737 , MSP430FR5738 , MSP430FR5739


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RHA Package - MSP430FR5731, MSP430FR5733, MSP430FR5735, MSP430FR5737, MSP430FR5739
    2. 4.2 Pin Diagram - DA Package - MSP430FR5731, MSP430FR5733, MSP430FR5735, MSP430FR5737, MSP430FR5739
    3. 4.3 Pin Diagram - RGE Package - MSP430FR5730, MSP430FR5732, MSP430FR5734, MSP430FR5736, MSP430FR5738
    4. 4.4 Pin Diagram - YQD Package - MSP430FR5738
    5. 4.5 Pin Diagram - PW Package - MSP430FR5730, MSP430FR5732, MSP430FR5734, MSP430FR5736, MSP430FR5738
    6. 4.6 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs - General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5, RST/NMI)
    8. 5.8  Inputs - Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current - General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5, RST/NMI)
    10. 5.10 Outputs - General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5)
    11. 5.11 Output Frequency - General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5)
    12. 5.12 Typical Characteristics - Outputs
    13. 5.13 Crystal Oscillator, XT1, Low-Frequency (LF) Mode
    14. 5.14 Crystal Oscillator, XT1, High-Frequency (HF) Mode
    15. 5.15 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    16. 5.16 DCO Frequencies
    17. 5.17 MODOSC
    18. 5.18 PMM, Core Voltage
    19. 5.19 PMM, SVS, BOR
    20. 5.20 Wake-up Times From Low-Power Modes
    21. 5.21 Timer_A
    22. 5.22 Timer_B
    23. 5.23 eUSCI (UART Mode) Clock Frequency
    24. 5.24 eUSCI (UART Mode)
    25. 5.25 eUSCI (SPI Master Mode) Clock Frequency
    26. 5.26 eUSCI (SPI Master Mode)
    27. 5.27 eUSCI (SPI Slave Mode)
    28. 5.28 eUSCI (I2C Mode)
    29. 5.29 10-Bit ADC, Power Supply and Input Range Conditions
    30. 5.30 10-Bit ADC, Timing Parameters
    31. 5.31 10-Bit ADC, Linearity Parameters
    32. 5.32 REF, External Reference
    33. 5.33 REF, Built-In Reference
    34. 5.34 REF, Temperature Sensor and Built-In VMID
    35. 5.35 Comparator_D
    36. 5.36 FRAM
    37. 5.37 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Functional Block Diagrams
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Memory Organization
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM
    9. 6.9  Memory Protection Unit (MPU)
    10. 6.10 Peripherals
      1. 6.10.1  Digital I/O
      2. 6.10.2  Oscillator and Clock System (CS)
      3. 6.10.3  Power-Management Module (PMM)
      4. 6.10.4  Hardware Multiplier (MPY)
      5. 6.10.5  Real-Time Clock (RTC_B)
      6. 6.10.6  Watchdog Timer (WDT_A)
      7. 6.10.7  System Module (SYS)
      8. 6.10.8  DMA Controller
      9. 6.10.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.10.10 TA0, TA1
      11. 6.10.11 TB0, TB1, TB2
      12. 6.10.12 ADC10_B
      13. 6.10.13 Comparator_D
      14. 6.10.14 CRC16
      15. 6.10.15 Shared Reference (REF)
      16. 6.10.16 Embedded Emulation Module (EEM)
      17. 6.10.17 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      2. 6.11.2  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P2 (P2.7) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P3 (P3.4 to P3.6) Input/Output With Schmitt Trigger
      10. 6.11.10 Port Port P3 (P3.7) Input/Output With Schmitt Trigger
      11. 6.11.11 Port Port P4 (P4.0) Input/Output With Schmitt Trigger
      12. 6.11.12 Port Port P4 (P4.1) Input/Output With Schmitt Trigger
      13. 6.11.13 Port Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
      14. 6.11.14 Port Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors (TLV)
  7. 7Device and Documentation Support
    1. 7.1  Getting Started
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Getting Started

TI provides all of the hardware platforms and software components and tooling you need to get started today! Not only that, TI has many complementary components to meet your needs. For an overview of the MSP430™ MCU product line, the available development tools and evaluation kits, and advanced development resources, visit the MSP430 Getting Started page.

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified production devices and tools (with MSP for devices and MSP for tools).

Device development evolutionary flow:

XMS – Experimental device that is not necessarily representative of the electrical specifications for the final device

PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed quality and reliability verification

MSP – Fully qualified production device

Support tool development evolutionary flow:

MSPX – Development-support product that has not yet completed TI's internal qualification testing.

MSP – Fully-qualified development-support product

XMS and PMS devices and MSPX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

MSP430FR5739 MSP430FR5738 MSP430FR5737 MSP430FR5736 MSP430FR5735 MSP430FR5734 MSP430FR5733 MSP430FR5732 MSP430FR5731 MSP430FR5730 Part_Number_Decoder_MSP430.gif Figure 7-1 Device Nomenclature

Tools and Software

Table 7-1 lists the debug features supported by these microcontrollers. See the Code Composer Studio for MSP430 User's Guide for details on the available features.

Table 7-1 Hardware Features

MSP430Xv2 Yes Yes 3 Yes Yes No No Yes

Design Kits and Evaluation Modules

    EEPROM Emulation and Sensing With MSP430 FRAM Microcontrollers This TI Design reference design describes an implementation of emulating EEPROM using Ferroelectric Random Access Memory (FRAM) technology on MSP430™ ultra-low-power microcontrollers (MCUs) combined with the additional sensing capabilities that can be enabled when using an MCU. The reference design supports both I2C and SPI interface to a host processor with multiple slave addressing.
    MSP-EXP430FR5739 Experimenter Board The MSP-EXP430FR5739 Experimenter Board is a development platform for the MSP430FR57xx devices. It supports this new generation of MSP430 microcontroller devices with integrated Ferroelectric Random Access Memory (FRAM). The board is compatible with many TI low-power RF wireless evaluation modules such as the CC2520EMK. The Experimenter Board helps designers quickly learn and develop using the new MSP430FR57xx MCUs, which provide the industry's lowest overall power consumption, fast data read /write and unbeatable memory endurance. The MSP-EXP430FR5739 Experimenter Board can help evaluate and drive development for data logging applications, energy harvesting, wireless sensing, automatic metering infrastructure (AMI) and many others.


    MSP430Ware™ Software MSP430Ware software is a collection of code examples, data sheets, and other design resources for all MSP430 devices delivered in a convenient package. In addition to providing a complete collection of existing MSP430 design resources, MSP430Ware software also includes a high-level API called MSP430 Driver Library. This library makes it easy to program MSP430 hardware. MSP430Ware software is available as a component of CCS or as a stand-alone package.
    MSP Driver Library Driver Library's abstracted API keeps you above the bits and bytes of the MSP430 hardware by providing easy-to-use function calls. Thorough documentation is delivered through a helpful API Guide, which includes details on each function call and the recognized parameters. Developers can use Driver Library functions to write complete projects with minimal overhead.
    MSP EnergyTrace™ Technology EnergyTrace technology for MSP430 microcontrollers is an energy-based code analysis tool that measures and displays the application’s energy profile and helps to optimize it for ultra-low-power consumption.
    ULP (Ultra-Low Power) Advisor ULP Advisor™ software is a tool for guiding developers to write more efficient code to fully utilize the unique ultra-low power features of MSP and MSP432 microcontrollers. Aimed at both experienced and new microcontroller developers, ULP Advisor checks your code against a thorough ULP checklist to squeeze every last nano amp out of your application. At build time, ULP Advisor will provide notifications and remarks to highlight areas of your code that can be further optimized for lower power.
    IEC60730 Software Package The IEC60730 MSP430 software package was developed to be useful in assisting customers in complying with IEC 60730-1:2010 (Automatic Electrical Controls for Household and Similar Use – Part 1: General Requirements) for up to Class B products, which includes home appliances, arc detectors, power converters, power tools, e-bikes, and many others. The IEC60730 MSP430 software package can be embedded in customer applications running on MSP430s to help simplify the customer’s certification efforts of functional safety-compliant consumer devices to IEC 60730-1:2010 Class B.
    Fixed-Point Math Library for MSP The MSP IQmath and Qmath Libraries are a collection of highly optimized and high-precision mathematical functions for C programmers to seamlessly port a floating-point algorithm into fixed-point code on MSP430 and MSP432 devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed, high accuracy, and ultra-low energy are critical. By using the IQmath and Qmath libraries, it is possible to achieve execution speeds considerably faster and energy consumption considerably lower than equivalent code written using floating-point math.
    Floating-Point Math Library for MSP430 Continuing to innovate in the low power and low cost microcontroller space, TI brings you MSPMATHLIB. Leveraging the intelligent peripherals of our devices, this floating point math library of scalar functions brings you up to 26x better performance. Mathlib is easy to integrate into your designs. This library is free and is integrated in both Code Composer Studio and IAR IDEs. Read the user’s guide for an in depth look at the math library and relevant benchmarks.

Development Tools

    Code Composer Studio™ Integrated Development Environment for MSP Microcontrollers Code Composer Studio is an integrated development environment (IDE) that supports all MSP microcontroller devices. Code Composer Studio comprises a suite of embedded software utilities used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar utilities and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers. When using CCS with an MSP MCU, a unique and powerful set of plugins and embedded software utilities are made available to fully leverage the MSP microcontroller.
    Command-Line Programmer MSP Flasher is an open-source shell-based interface for programming MSP microcontrollers through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP Flasher can download binary files (.txt or .hex) files directly to the MSP microcontroller without an IDE.
    MSP MCU Programmer and Debugger The MSP-FET is a powerful emulation development tool – often called a debug probe – which allows users to quickly begin application development on MSP low-power microcontrollers (MCU). Creating MCU software usually requires downloading the resulting binary program to the MSP device for validation and debugging. The MSP-FET provides a debug communication pathway between a host computer and the target MSP. Furthermore, the MSP-FET also provides a Backchannel UART connection between the computer's USB interface and the MSP UART. This affords the MSP programmer a convenient method for communicating serially between the MSP and a terminal running on the computer. It also supports loading programs (often called firmware) to the MSP target using the BSL (bootloader) through the UART and I2C communication protocols.
    MSP-GANG Production Programmer The MSP Gang Programmer is an MSP430 or MSP432 device programmer that can program up to eight identical MSP430 or MSP432 Flash or FRAM devices at the same time. The MSP Gang Programmer connects to a host PC using a standard RS-232 or USB connection and provides flexible programming options that allow the user to fully customize the process. The MSP Gang Programmer is provided with an expansion board, called the Gang Splitter, that implements the interconnections between the MSP Gang Programmer and multiple target devices. Eight cables are provided that connect the expansion board to eight target devices (through JTAG or Spy-Bi-Wire connectors). The programming can be done with a PC or as a stand-alone device. A PC-side graphical user interface is also available and is DLL-based.

Documentation Support

The following documents describe the MSP430FR573x MCUs. Copies of these documents are available on the Internet at

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on (for example, MSP430FR5739). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.


User's Guides

    MSP430 Programming With the Bootloader (BSL) The MSP430 bootloader (BSL, formerly known as the bootstrap loader) allows users to communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.
    MSP430 Programming With the JTAG Interface This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
    MSP430 Hardware Tools User's Guide This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

Application Reports

    MSP430 FRAM Technology – How To and Best Practices FRAM is a nonvolatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specific code, constant, data space requirements, the use of FRAM to optimize application energy consumption, and the use of the Memory Protection Unit (MPU) to maximize application robustness by protecting the program code against unintended write accesses.
    MSP430 FRAM Quality and Reliability FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endurance.
    Maximizing Write Speed on the MSP430™ FRAM Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430™ FRAM-based devices, and discusses tradeoffs such as CPU clock frequency and block size and how they impact the FRAM write speed.
    MSP430 System-Level ESD Considerations System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs: (1) Component-level ESD testing and system-level ESD testing, their differences and why component-level ESD rating does not ensure system-level robustness. (2) General design guidelines for system-level ESD protection at different levels including enclosures, cables, PCB layout, and on-board ESD protection devices. (3) Introduction to System Efficient ESD Design (SEED), a co-design methodology of on-board and on-chip ESD protection to achieve system-level ESD robustness, with example simulations and test results. A few real-world system-level ESD protection design examples and their results are also discussed.
    MSP430 32-kHz Crystal Oscillators Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.

Related Links

Table 7-2 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.


MSP430, MSP430Ware, EnergyTrace, ULP Advisor, Code Composer Studio, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.


    TI Glossary This glossary lists and explains terms, acronyms, and definitions.