SLASF90C October   2023  – February 2025 MSPM0C1103 , MSPM0C1104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagrams
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Windowed Watchdog Characteristics
    19. 7.19 Emulation and Debug
      1. 7.19.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0C110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 CRC
    16. 8.16 UART
    17. 8.17 SPI
    18. 8.18 I2C
    19. 8.19 WWDT
    20. 8.20 Timers (TIMx)
    21. 8.21 Device Analog Connections
    22. 8.22 Input/Output Diagrams
    23. 8.23 Serial Wire Debug Interface
    24. 8.24 Device Factory Constants
    25. 8.25 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYY|16
  • DDF|8
  • RUK|20
  • DGS|20
  • DSG|8
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.11.1 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted), all TYP values are measured at 25℃ and all accuracy parameters are measured using 12-bit resolution mode (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vin(ADC) Analog input voltage range(1) Applies to all ADC analog input pins 0 VDD V
VR+ Positive ADC reference voltage VR+ sourced from VDD VDD V
VR+ sourced from internal reference (VREF) VREF V
VR- Negative ADC reference voltage 0 V
Fs ADC sampling frequency RES = 0x0 (12-bit mode), VDD Reference 1.5 Msps
RES = 0x1 (10-bit mode), VDD Reference 1.7
RES = 0x2 (8-bit mode), VDD Reference 2
FS ADC sampling frequency RES = 0x0 (12-bit mode), Internal Reference 0.866 Msps
RES = 0x1 (10-bit mode), Internal Reference 1
RES = 0x2 (8-bit mode), Internal Reference 1.2
I(ADC) Operating supply current
into VDD terminal		 FS = 1.5MSPS, VR+ = VDD 200 220 μA
FS = 0.856MSPS,VR+ = VREF = 2.5V  (VREF power consumption included) 220 250
CS/H ADC sample-and-hold capacitance 0.22 pF
Rin ADC switch resistance 25 kΩ
ENOB Effective number of bits VDD reference (2) 9.3 10.4 bit
VDD reference with over sampling 12.2
Internal reference, VR+ = VREF = 2.5V 9.4 9.8
SNR Signal-to-noise ratio VDD reference (2) 64 dB
VDD reference with over sampling 75
Internal reference, VR+ = VREF = 2.5V  61
PSRRDC Power supply rejection ratio, DC VDD = VDD(min) to VDD(max)
Internal reference, VR+ = VREF = 2.5V 		 61 dB
Twakeup ADC Wakeup Time Assumes internal reference is active 5 us
VSupplyMon Supply Monitor voltage divider (VDD/3) accuracy ADC input channel: Supply Monitor (3) -0.6 +2.5 %
ISupplyMon Supply Monitor voltage divider current consumption ADC input channel: Supply Monitor 10 uA
(1) The analog input voltage range must be within the selected ADC reference voltage range VR+ to VR– for valid conversion results.
(2) VDD reference specifications are measured with VR+ = VDD = 3.3V and VR- = VSS = 0V
(3) Analog power supply monitor. Analog input on channel 15 is disconnected and is internally connected to the voltage divider which is VDD/3.