10.1 Layout Guidelines
Careful attention to assembly parasitics and external components is necessary to achieve optimal performance.
- Minimize the total capacitance on the IN pad by using a low capacitance photodiode (100fF) and paying attention to stray capacitances. Place the photodiode close to the ONET2804T die and keep the wire bond inductance in the range of 300 to 400pH.
- Use identical termination and symmetrical transmission lines at the AC coupled differential output pins OUT+ and OUT–.
- Use short bond wire connections for the supply terminals VCCIx, VCCOx and GND. Supply voltage filtering is provided on chip but filtering may be improved by using an additional external capacitor.
- The die has backside metal and conductive epoxy must be used to attach the die to ground.