SBOS642C March   2013  – January 2020 OPA188

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Auto-Zero Technology Provides Ultra-Low Temperature Drift
  4. Revision History
  5. Device Comparison Table
    1. 5.1 Portfolio Comparison
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: High-Voltage Operation
    6. 7.6 Electrical Characteristics: Low-Voltage Operation
    7. 7.7 Typical Characteristics: Table of Graphs
      1. 7.7.1 Table of Graphs
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Input Bias Current Clock Feedthrough
      4. 8.3.4 Internal Offset Correction
      5. 8.3.5 EMI Rejection
      6. 8.3.6 Capacitive Load and Stability
      7. 8.3.7 Electrical Overstress
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete INA + Attenuation for ADC With 3.3-V Supply
      3. 9.2.3 Bridge Amplifier
      4. 9.2.4 Low-Side Current Monitor
      5. 9.2.5 Programmable Power Supply
      6. 9.2.6 RTD Amplifier With Linearization
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Download Software)
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table of Graphs

Table 2. Typical Characteristic Graphs

DESCRIPTION FIGURE
Offset Voltage Production Distribution Figure 1
Offset Voltage Drift Distribution Figure 2
Offset Voltage vs Temperature Figure 3
Offset Voltage vs Common-Mode Voltage Figure 4, Figure 5
Offset Voltage vs Power Supply Figure 6
Open-Loop Gain and Phase vs Frequency Figure 7
Closed-Loop Gain vs Frequency Figure 8
IB and IOS vs Common-Mode Voltage Figure 9
Input Bias Current vs Temperature Figure 10
Output Voltage Swing vs Output Current (Maximum Supply) Figure 11
CMRR and PSRR vs Frequency (Referred-to-Input) Figure 12
CMRR vs Temperature Figure 13, Figure 14
PSRR vs Temperature Figure 15
0.1-Hz to 10-Hz Noise Figure 16
Input Voltage Noise Spectral Density vs Frequency Figure 17
THD+N Ratio vs Frequency Figure 18
THD+N vs Output Amplitude Figure 19
Quiescent Current vs Supply Voltage Figure 20
Quiescent Current vs Temperature Figure 21
Open-Loop Gain vs Temperature Figure 22
Open-Loop Output Impedance vs Frequency Figure 23
Small-Signal Overshoot vs Capacitive Load (100-mV Output Step) Figure 24, Figure 25
No Phase Reversal Figure 26
Positive Overload Recovery Figure 27
Negative Overload Recovery Figure 28
Small-Signal Step Response (100 mV) Figure 29, Figure 30
Large-Signal Step Response Figure 31, Figure 32
Large-Signal Settling Time (10-V Positive Step) Figure 33
Large-Signal Settling Time (10-V Negative Step) Figure 34
Short-Circuit Current vs Temperature Figure 35
Maximum Output Voltage vs Frequency Figure 36
EMIRR IN+ vs Frequency Figure 37