SBOS926G January 2021 – April 2024 OPA2392 , OPA392
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | OPA392 | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) | YBJ (DSBGA) | |||
5 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 187.1 | 135.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 107.4 | 1.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.5 | 38.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 33.5 | 0.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 57.1 | 38.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |