SBOS697B September   2014  – July 2026 REF19

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Thermal Hysteresis
    3. 7.3 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VREF and VBIAS Tracking
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Load Current
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shunt Resistor
        2. 9.2.2.2 Differential Amplifier
        3. 9.2.2.3 Voltage Reference
        4. 9.2.2.4 Results
      3. 9.2.3 Application Curves
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.3 Load Current

The REF19xx family is specified to deliver a current load of ±20mA per output. Both the VREF and VBIAS outputs of the device are protected from short circuits by limiting the output short-circuit current to 50mA. The device temperature increases according to Equation 5:

Equation 5. REF19

where

  • TJ = junction temperature (°C)
  • TA = ambient temperature (°C)
  • PD = power dissipated (W)
  • RθJA = junction-to-ambient thermal resistance (°C/W)

The REF19xx maximum junction temperature must not exceed the absolute maximum rating of 150°C.