SBVS046E December   2003  – April 2026 REF31

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Voltage
      2. 7.3.2 Thermal Hysteresis
      3. 7.3.3 Temperature Drift
      4. 7.3.4 Noise Performance
      5. 7.3.5 Long-Term Stability
      6. 7.3.6 Load Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Negative Reference Voltage
      2. 7.4.2 Data Acquisition
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Figure 8-6 illustrates an example of a printed-circuit board (PCB) layout using the REF31xx. Some key considerations are:

  • Connect low-ESR, 0.47μF ceramic bypass capacitors at VIN of the REF31xx
  • Decouple other active devices in the system per the device specifications
  • Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup
  • Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring
  • Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary