SNVSCN7C November   2023  – May 2025 REF54

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics REF54250
    6. 6.6  Electrical Characteristics REF54300
    7. 6.7  Electrical Characteristics REF54410
    8. 6.8  Electrical Characteristics REF54450
    9. 6.9  Electrical Characteristics REF54500
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Temperature Drift
    2. 7.2 Long-Term Stability
    3. 7.3 Noise Performance
      1. 7.3.1 1/f Noise
      2. 7.3.2 Broadband Noise
    4. 7.4 Thermal Hysteresis
    5. 7.5 Solder Heat Shift
    6. 7.6 Power Dissipation
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EN Pin
      2. 8.3.2 NR Pin
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Voltage Reference Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Reference Attach With High Precision ADC
    3. 9.3 Power Supply Recommendation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Typical Characteristics

at TA = 25°C, VIN = VEN = VREF + 0.5V, IL = 0mA, COut = CREF = 10μF, CNR = Open, CIN = 0.1μF, VREF = 2.5V (unless otherwise noted)

REF54 Output Voltage Vs Free-Air Temperature for C gradeFigure 6-1 Output Voltage Vs Free-Air Temperature for C grade
REF54 Accuracy DistributionFigure 6-3 Accuracy Distribution
REF54 Load Regulation (Sourcing) vs TemperatureFigure 6-5 Load Regulation (Sourcing) vs Temperature
REF54 Line Transient ResponseFigure 6-7 Line Transient Response
REF54 Load Transient Response (COUT = 1μF)Figure 6-9 Load Transient Response (COUT = 1μF)
REF54 Quiescent Current vs TemperatureFigure 6-11 Quiescent Current vs Temperature
REF54 Dropout Voltage vs TemperatureFigure 6-13 Dropout Voltage vs Temperature
REF54 Noise Performance 10Hz to 100kHz (CNR = Open)Figure 6-15 Noise Performance 10Hz to 100kHz
(CNR = Open)
REF54 REF54250 Thermal Hysteresis Distribution (0°C to 70°C)Figure 6-17 REF54250 Thermal Hysteresis Distribution
(0°C to 70°C)
REF54 Long-Term Stability SOIC package 7500 HoursFigure 6-19 Long-Term Stability SOIC package 7500 Hours
REF54 Temperature Drift DistributionFigure 6-2 Temperature Drift Distribution
REF54 Line Regulation vs TemperatureFigure 6-4 Line Regulation vs Temperature
REF54 Load Regulation (Sinking) vs TemperatureFigure 6-6 Load Regulation (Sinking) vs Temperature
REF54 Load Transient Response (COUT = 10μF)Figure 6-8 Load Transient Response (COUT = 10μF)
REF54 Output ImpedanceFigure 6-10 Output Impedance
REF54 Shutdown Current vs TemperatureFigure 6-12 Shutdown Current vs Temperature
REF54 0.1Hz to 10Hz Voltage Noise Distribution (CNR = Open) Figure 6-14 0.1Hz to 10Hz Voltage Noise Distribution
(CNR = Open)
REF54 Power-Supply Rejection Ratio vs FrequencyFigure 6-16 Power-Supply Rejection Ratio vs Frequency
REF54 Long-Term Stability SOIC package 2000 HoursFigure 6-18 Long-Term Stability SOIC package 2000 Hours
REF54 Long-Term Stability FKH package 2000 HoursFigure 6-20 Long-Term Stability FKH package 2000 Hours