SCAS520J August   1995  – April 2025 SN54ACT74 , SN74ACT74

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Timing Requirements
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Thermal Information

THERMAL METRIC(1) SN74ACT74
BQA (WQFN) D (SOIC) DB (SSOP) N
(PDIP)		 NS
(SOP)		 PW
(TSSOP)		 UNIT
14 PINS
RθJA Junction-to-ambient
thermal resistance		 91.3 119.9 96 80 76 145.7 °C/W
RθJC(top) Junction-to-case (top)
thermal resistance		 99.4 — — — — — °C/W
RθJB Junction-to-board
thermal resistance		 60.1 — — — — — °C/W
ψJT Junction-to-top
characterization parameter		 14.5 — — — — — °C/W
ψJB Junction-to-board characterization parameter 60.8 — — — — — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 37.0 — — — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.