SLLSFC4 July   2019 SN65C1168E-SEP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Driver Section Electrical Characteristics
    6. 6.6 Receiver Section Electrical Characteristics
    7. 6.7 Driver Section Switching Characteristics
    8. 6.8 Receiver Section Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Active High Driver Output Enables
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • VID V62/19606
  • Radiation hardened
    • Single event latch-up (SEL) immune to 43 MeV-cm2/mg at 125°C
    • ELDRS-free to 30 krad(Si)
    • Total ionizing dose (TID) RLAT for every wafer lot up to 20 krad(Si)
  • Space Enhanced Plastic
    • Controlled baseline
    • Gold wire
    • NiPdAu lead finish
    • One assembly and test site
    • One fabrication site
    • Available in military (–55°C to 125°C) temperature range
    • Extended product life cycle
    • Extended product-change notification
    • Product traceability
    • Enhanced mold compound for low outgassing
  • Meet or exceed standards TIA/EIA-422-B and ITU recommendation V.11
  • Operate from single 5-V power supply
  • ESD protection for RS-422 bus pins
    • ±12-kV human-body model (HBM)
    • ±8-kV IEC 61000-4-2, contact discharge
    • ±8-kV IEC 61000-4-2, air-gap discharge
  • Low-pulse skew
  • Receiver input impedance . . . 17 kΩ (typical)
  • Receiver input sensitivity . . . ±200 mV
  • Receiver common-mode input voltage range of
    –7 V to 7 V
  • Glitch-free power-up/power-down protection