SLLS500B May   2001  – October 2023 SN65LBC182 , SN75LBC182

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Dissipation Rating
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Receiver Electrical Characteristics
    8. 5.8  Driver Switching Characteristics
    9. 5.9  Receiver Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1) D (SOIC) P (PDIP) UNIT
8-PINS
R θJA Junction-to-ambient thermal resistance 116.7 84.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.3 65.4 °C/W
R θJB Junction-to-board thermal resistance 63.4 62.1 °C/W
ψ JT Junction-to-top characterization parameter 8.8 31.3 °C/W
ψ JB Junction-to-board characterization parameter 62.6 60.4 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.