SLLS500B May   2001  – October 2023 SN65LBC182 , SN75LBC182

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Dissipation Rating
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Receiver Electrical Characteristics
    8. 5.8  Driver Switching Characteristics
    9. 5.9  Receiver Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Dissipation Rating

PACKAGE(2) TA ≤ 25°C POWER RATING DERATING FACTOR(1) ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING
D 725 mW 5.8 mW/°C 464 mW 377 mW
P 1150 mW 9.2 mW/°C 736 mW 598 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) The maximum operating junction temperature is internally limited. Use the dissipation rating table to operate below this temperature