SCAS993B March   2024  – February 2025 SN74ACT08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
      1. 8.3.1 Power Considerations
      2. 8.3.2 Input Considerations
      3. 8.3.3 Output Considerations
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curves
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74ACT08-Q1 UNIT
BQA (WQFN) PW (TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 91.3 145.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 99.4 76.5 °C/W
RθJB Junction-to-board thermal resistance 61.0 102.0 °C/W
ΨJT Junction-to-top characterization parameter 14.5 18.8 °C/W
ΨJB Junction-to-board characterization parameter 60.8 100.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 37.0 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.