SLVSJO5 August   2025 SN74AHCT541-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
          1. 8.1.1.1.1 Power Considerations
          2. 8.1.1.1.2 Input Considerations
          3. 8.1.1.1.3 Output Considerations
        2. 8.1.1.2 Detailed Design Procedure
        3. 8.1.1.3 Application Curves
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74AHCT541-Q1 SN74AHCT541-Q1 RKS Package (Top View)Figure 4-1 SN74AHCT541-Q1 RKS Package (Top View)
SN74AHCT541-Q1 SN74AHCT541-Q1 PW, DGS Package (Top View)Figure 4-2 SN74AHCT541-Q1 PW, DGS Package
(Top View)
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
OE1 1 I Output enable 1, active low
A1 2 I Input for channel 1
A2 3 I Input for channel 2
A3 4 I Input for channel 3
A4 5 I Input for channel 4
A5 6 I Input for channel 5
A6 7 I Input for channel 6
A7 8 I Input for channel 7
A8 9 I Input for channel 8
GND 10 G Ground
Y8 11 O Output for channel 8
Y7 12 O Output for channel 7
Y6 13 O Output for channel 6
Y5 14 O Output for channel 5
Y4 15 O Output for channel 4
Y3 16 O Output for channel 3
Y2 17 O Output for channel 2
Y1 18 O Output for channel 1
OE2 19 I Output enable 2, active low
VCC 20 P Postive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, G = Ground, P = Power.
(2) RKS package only.