SCLS374P May   1997  – April 2024 SN74AHCT595

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Switching Characteristics
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • DB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision O (March 2024) to Revision P (April 2024)

  • Updated thermal values for PW package from RθJA = 105.7 to 135.9, RθJC(top) = 40.4 to 70.3, RθJB = 50.7 to 81.3, ΨJT = 3.7 to 22.5, ΨJB = 50.1 to 80.8, all values in °C/WGo

Changes from Revision N (July 2020) to Revision O (March 2024)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Updated pin counts in Device Information tableGo
  • Updated part number in Device Information tableGo
  • Added BQB package to Package Information table, Pin Configuration and Functions section, and Thermal Information tableGo