SCES553H May   2004  – November 2020 SN74AVC32T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revison History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: VCCA = 1.2 V
    7. 7.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 7.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 7.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 7.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 7.11 Operating Characteristics
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 9.3.2 Partial-Power-Down Mode Operation
      3. 9.3.3 VCC Isolation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 EnableTimes
    3. 10.3 Typical Application
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
        1. 10.3.2.1 Input Voltage Ranges
        2. 10.3.2.2 Output Voltage Range
      3. 10.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Thermal Information

THERMAL METRIC(1)SN74AVC32T245UNIT
GKE/ZKE (LFBGA)ZRL (MICROSTAR JUNIOR)NMJ (nFBGA)
96 PINS96 PINS96 PINS
RθJAJunction-to-ambient thermal resistance70.7105.826.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance34.01.614.4°C/W
RθJBJunction-to-board thermal resistance43.510.810.7°C/W
ψJTJunction-to-top characterization parameter3.53.11.3°C/W
ψJBJunction-to-board characterization parameter43.510.810.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.