SCES576H June   2004  – March 2024 SN74AVC4T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Operating Characteristics
    7. 5.7  Switching Characteristics: VCCA = 1.2V
    8. 5.8  Switching Characteristics: VCCA = 1.5V ± 0.1V
    9. 5.9  Switching Characteristics: VCCA = 1.8V ± 0.15V
    10. 5.10 Switching Characteristics: VCCA = 2.5V ± 0.2V
    11. 5.11 Switching Characteristics: VCCA = 3.3V ± 0.3V
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision G (November 2014) to Revision H (March 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the BQB and DYY package information throughout the data sheet.Go
  • Updated the package information table to include package lead size.Go

Changes from Revision F (October 2014) to Revision G (November 2014)

  • Changed Pin Functions table. Go
  • Changed Typical Application schematic. Go

Changes from Revision E (December 2011) to Revision F (October 2014)

  • Added Applications, Pin Configuration and Functions section, Handling Rating table, Thermal Information table, Feature Description section, Typical Characteristics section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision D (September 2007) to Revision E (December 2011)

  • Fixed tPZL VCCB = 3.3V parameter typographical error from 36.6 to 3.6.Go