SCES576H June   2004  – March 2024 SN74AVC4T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Operating Characteristics
    7. 5.7  Switching Characteristics: VCCA = 1.2V
    8. 5.8  Switching Characteristics: VCCA = 1.5V ± 0.1V
    9. 5.9  Switching Characteristics: VCCA = 1.8V ± 0.15V
    10. 5.10 Switching Characteristics: VCCA = 2.5V ± 0.2V
    11. 5.11 Switching Characteristics: VCCA = 3.3V ± 0.3V
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AVC4T245 UNIT
D

BQB

DYY

 DGV PW RGY RSV
16 PINS
RθJA Junction-to-ambient thermal resistance 85.5

80.8

163.4

 126.0 101.8 37.5 146.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.9

77.9

90.0

 50.8 37.2 54.5 53.6
RθJB Junction-to-board thermal resistance 43.0

50.7

93.1

 57.7 60.6 15.6 75.6
ψJT Junction-to-top characterization parameter 13.4

7.4

10.9

 5.7 1.6 0.5 13.5
ψJB Junction-to-board characterization parameter 42.7

50.6

92.1

 57.2 60.0 15.8 75.6
RθJC(bot) Junction-to-case (bottom) thermal resistance —

28.4

—

 — — 3.5 —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).