SCES901D February   2019  – January 2024 SN74AXC1T45-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics: TA = 25°C
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard CMOS Inputs
      2. 7.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3 Partial Power Down (Ioff)
      4. 7.3.4 VCC Isolation
      5. 7.3.5 Over-voltage Tolerant Inputs
      6. 7.3.6 Negative Clamping Diodes
      7. 7.3.7 Fully Configurable Dual-Rail Design
      8. 7.3.8 I/Os with Integrated Static Pull-Down Resistors
      9. 7.3.9 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Enable Times
    2. 8.2 Typical Applications
      1. 8.2.1 Interrupt Request Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Universal Asynchronous Receiver-Transmitter (UART) Interface Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AXC1T45-Q1UNIT
DCK (SC70)DRY (SON)
6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance235.3305.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance160.5202.2°C/W
RθJBJunction-to-board thermal resistance76.9181.1°C/W
ψJTJunction-to-top characterization parameter59.741.9°C/W
ψJBJunction-to-board characterization parameter77.1180.0°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.