SCDS145D October   2003  – August 2026 SN74CB3Q3253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: RGY, PW, DBQ, DGV Packages
    6. 5.6 Electrical Characteristics: DYY Package
    7. 5.7 Switching Characteristics: RGY, PW, DBQ, DGV Packages
    8. 5.8 Switching Characteristics: DYY Package
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DBQ|16
  • RGY|16
  • DGV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 Typical Characteristics

SN74CB3Q3253 Typical ron vs VI, VCC = 3.3V and IO = –15mAFigure 5-1 Typical ron vs VI, VCC = 3.3V and IO = –15mA
SN74CB3Q3253 Typical ICC vs OE or S Switching Frequency, VCC = 3.3VFigure 5-2 Typical ICC vs OE or S Switching Frequency, VCC = 3.3V