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3.3-V, 4:1, 2-channel FET Bus Switch

SN74CB3Q3253

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Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Power supply voltage - single (V) 2.5, 3.3 Ron (Typ) (Ohms) 3.5 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports I2C signals, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 64 Rating Catalog CON (Typ) (pF) 13 Supply current (Typ) (uA) 700 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches & muxes

Features

  • High-Bandwidth Data Path (Up to 500 MHz) (1)
  • 5-V Tolerant I/Os With Device Powered Up or Powered Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Ω Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0- to 5-V Switching With 3.3-V VCC
    • 0- to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 3.5 pF Typical)
  • Fast Switching Frequency (fOE = 20 MHz Max)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 0.6 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signal Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
  • Control Inputs Can be Driven by TTL or 5-V and 3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface Bus Isolation, Low-Distortion Signal Gating (1)

(1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report CBT-C, CB3T, and CB3Q Signal-Switch Families, (SCDA008).

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Description

The SN74CB3Q3253 device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input and output (I/O) ports.

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Technical documentation

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Type Title Date
* Data sheet SN74CB3Q3253 Dual 1-of-4 FET Multiplexer – Demultiplexer 2.5-V – 3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. C) Jun. 27, 2018
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. B) Jun. 08, 2021
Application note Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) Jan. 06, 2021
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM060.ZIP (25 KB) - IBIS Model
SIMULATION MODEL Download
SCEJ209.ZIP (96 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

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  • Qualification summary
  • Ongoing reliability monitoring

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