SCLS181H December   1982  – August 2021 SN54HC00 , SN74HC00

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Commercial (74xx)
    6. 6.6 Electrical Characteristics - Military (54xx)
    7. 6.7 Switching Characteristics - Commercial (74xx)
    8. 6.8 Switching Characteristics - Military (54xx)
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Balanced CMOS Push-Pull Outputs
    4. 8.4 Standard CMOS Inputs
    5. 8.5 Clamp Diode Structure
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (January 2021) to Revision H (August 2021)

  •  Increased D and PW package thermal valuesGo

Changes from Revision F (July 2016) to Revision G (January 2021)

  • Updated to new data sheet formatGo
  • Updated D and PW package thermals to new standardsGo

Changes from Revision E (August 2003) to Revision F (July 2016)

  • Added Applications section, Device Information table, ESD Ratings table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added Military Disclaimer to Features listGo
  • Removed Ordering Information table; see POA at the end of data sheet.Go
  • Changed values in the Thermal Information table to align with JEDEC standardsGo
  • Deleted Operating Characteristics table; moved Cpd row to Electrical Characteristics Go