SCLS145E December 1982 – July 2022 SN74HC563
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC | DW (SOIC) | N (PDIP) | UNIT | |
---|---|---|---|---|
20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 84.6 | °C/W |
RθJC (top) | Junction-to-case (top) thermal resistance | 76 | 72.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 77.6 | 65.3 | °C/W |
ΨJT | Junction-to-top characterization parameter | 51.5 | 55.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 77.1 | 65.2 | °C/W |
RθJC (bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |