SCLS041J December   1982  – October 2021 SN54HC595 , SN74HC595

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54HC595SN74HC595UNIT
MINNOMMAXMINNOMMAX
VCCSupply voltage256256V
VIHHigh-level input voltageVCC = 2 V1.51.5V
VCC = 4.5 V3.153.15
VCC = 6 V4.24.2
VILLow-level input voltageVCC = 2 V0.50.5V
VCC = 4.5 V1.351.35
VCC = 6 V1.81.8
VIInput voltage0VCC0VCCV
VOOutput voltage0VCC0VCCV
Δt/ΔvInput transition rise or fall time(2)VCC = 2 V10001000ns
VCC = 4.5 V500500
VCC = 6 V400400
TAOperating free-air temperature–55125–4085°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.
If this device is used in the threshold region (from VILmax = 0.5 V to VIH min = 1.5 V), there is a potential to go into the wrong state from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.