SCLS783C January   2020  – October 2026 SN74HCS86

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74HCS86 D, DYY, or PW Package14-Pin SOIC, SOT-23, or TSSOPTop ViewFigure 4-1 D, DYY, or PW Package
14-Pin SOIC, SOT-23, or TSSOP
Top View
SN74HCS86 BQA Package14-Pin WQFNTop ViewFigure 4-2 BQA Package
14-Pin WQFN
Top View
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Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1, Input A
1B 2 I Channel 1, Input B
1Y 3 O Channel 1, Output Y
2A 4 I Channel 2, Input A
2B 5 I Channel 2, Input B
2Y 6 O Channel 2, Output Y
GND 7 — Ground
3Y 8 O Channel 3, Output Y
3A 9 I Channel 3, Input A
3B 10 I Channel 3, Input B
4Y 11 O Channel 4, Output Y
4A 12 I Channel 4, Input A
4B 13 I Channel 4, Input B
VCC 14 — Positive Supply
Thermal Pad(1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable
(2) BQA Package only.