SCLS414T April   1998  – March 2023 SN74LV595A

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 6.12 Noise Characteristics
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Latching Logic
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Design Requirements
      5. 9.2.5 Detailed Design Procedure
      6. 9.2.6 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-77437250-2CCB-4CED-9FFE-AFDA41812B6A-low.gifFigure 5-1 D, DW, or PW Package,
16-Pin SOIC, SOP or TSSOP
(Top View)
GUID-20200810-CA0I-Q9NM-WJZN-2VVL5S1MZF0C-low.gifFigure 5-2 BQB or RGY Package,
16-Pin WQFN or VQFN
(Transparent Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
GND 8 G Ground Pin
OE 13 I

Output Enable Pin. Active LOW
QA 15 O QA Output
QB 1 O QB Output
QC 2 O QC Output
QD 3 O QD Output
QE 4 O QE Output
QF 5 O QF Output
QG 6 O QG Output
QH 7 O QH Output
QH' 9 O QH' Output
RCLK 12 I RCLK Input
SER 14 I SER Input
SRCLK 11 I SRCLK Input
SRCLR 10 I SRCLR Input
VCC 16 P Power Pin
Thermal Pad — Thermal Pad(2)
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power
(2) RGY and BQB package only