SLVSJK9
October 2025
SN74LVC1G09B
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
5
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Open-Drain CMOS Outputs
6.3.2
Partial Power Down (Ioff)
6.3.3
Standard CMOS Inputs
6.3.4
Clamp Diode Structure
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.1.1
Power Considerations
7.2.1.2
Input Considerations
7.2.1.3
Output Considerations
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
10.1
Tape and Reel Information
10.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
DBV|5
MPDS018T
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsjk9_oa
8.1.1
Related Documentation
For related documentation, see the following:
Texas Instruments,
CMOS Power Consumption and C
pd
Calculation
application note
Texas Instruments,
Designing With Logic
application note
Texas Instruments,
Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices
application note