SCES218AA April   1999  – October 2025 SN74LVC1G14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics: –40°C to 85°C
    7. 5.7 Switching Characteristics: –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 6.3.2 CMOS Schmitt-Trigger Inputs
      3. 6.3.3 Clamp Diodes
      4. 6.3.4 Partial Power Down (Ioff)
      5. 6.3.5 Over-Voltage Tolerant Inputs
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YZV|4
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74LVC1G14 DBV Package5-Pin SOT-23Top ViewFigure 4-1 DBV Package5-Pin SOT-23Top View
SN74LVC1G14 DCK Package5-Pin SC70Top ViewFigure 4-2 DCK Package5-Pin SC70Top View
SN74LVC1G14 DRL Package5-Pin SOT-5X3Top ViewFigure 4-3 DRL Package5-Pin SOT-5X3Top View
SN74LVC1G14 DRY Package6-Pin SONTop ViewFigure 4-4 DRY Package6-Pin SONTop View
SN74LVC1G14 DPW Package5-Pin X2SONTop ViewFigure 4-5 DPW Package5-Pin X2SONTop View
SN74LVC1G14 DSF Package6-Pin SONTop View
See mechanical drawings for dimensions.
N.C. – No internal connection
Figure 4-6 DSF Package6-Pin SONTop View
SN74LVC1G14 YZP Package5-Pin DSBGABottom View
DNU – Do not use
Figure 4-7 YZP Package5-Pin DSBGABottom View
SN74LVC1G14 YZV Package4-Pin DSBGABottom ViewFigure 4-8 YZV Package4-Pin DSBGABottom View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME DBV, DCK, DRL, DPW DRY, DSF YZP YZV
A 2 2 B1 A1 I Signal Input
GND 3 3 C1 B1 — Ground
N.C. 1 1, 5 — — — No internal connection (1)
DNU — — A1 — — Do not use (2)
VCC 5 6 A2 A2 — Positive Supply
Y 4 4 C2 B2 O Signal Output
(1) Pins labeled N.C. can be connected to any signal or voltage source, including ground. They should always be soldered to the board.
(2) Pins labeled DNU should not be connected to any signal or voltage source, including ground. They should always be soldered to the board.