Home Logic & voltage translation Buffers, drivers & transceivers Inverting buffers & drivers

SN74LVC1G14

ACTIVE
Order now

Single 1.65-V to 5.5-V inverter with Schmitt-Trigger inputs

Data sheet
Top
Single 1.65-V to 5.5-V inverter with Schmitt-Trigger inputs

SN74LVC1G14

ACTIVE
Data sheet Order now

Product details

Parameters

Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Number of channels (#) 1 IOL (Max) (mA) 32 IOH (Max) (mA) -32 ICC (Max) (uA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating Catalog open-in-new Find other Inverting buffers & drivers

Package | Pins | Size

DSBGA (YZP) 5 2 mm² .928 x 1.428 DSBGA (YZV) 4 0 mm² .928 x .928 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other Inverting buffers & drivers

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.6 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode Operation
 open-in-new Find other Inverting buffers & drivers

Description

This single Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G14 device contains one inverter and performs the Boolean function Y = A. The device functions as an independent inverter with Schmitt-trigger inputs, so the device has different input threshold levels for positive-going (VT+) and negative-going (VT–) signals to provide hysteresis (ΔVT) which makes the device tolerant to slow or noisy input signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

 open-in-new Find other Inverting buffers & drivers
Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 32
Type Title Date
* Data sheet SN74LVC1G14 Single Schmitt-Trigger Inverter datasheet (Rev. Y) Nov. 05, 2018
Application note Enabling Optimal Solar Inverter Power Stage Designs with Logic Aug. 17, 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Application note Designing and Manufacturing with TI's X2SON Packages Aug. 23, 2017
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
White paper Solving CMOS Transition Rate Issues Using Schmitt Trigger Solution (Rev. A) May 01, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Understanding Schmitt Triggers Sep. 21, 2011
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM419B.ZIP (46 KB) - IBIS Model
SIMULATION MODEL Download
SCEM535.ZIP (90 KB) - HSpice Model
SIMULATION MODEL Download
SCEM637.ZIP (7 KB) - PSpice Model

Reference designs

Many TI reference designs include the SN74LVC1G14 Use our reference design selection tool to review and identify designs that best match your application and parameters.
View reference designs

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 5 View options
DSBGA (YZV) 4 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Training series

View all TI training and videos

Videos