SCES424M January   2003  – August 2022 SN74LVC1G3157

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Analog Switch Characteristics
    7. 6.7 Switching Characteristics 85°C
    8. 6.8 Switching Characteristics 125°C
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G3157UNIT
DBV (SOT-23)DCK (SC70)DRL (SOT)DRY (SON)DTB (X2SON)YZP (DSBGA)
6 PINS6 PINS6 PINS6 PINS6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance234.9269.5244.1284.2324.5129.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance150.4189.5112.5138.6150.51.9°C/W
RθJBJunction-to-board thermal resistance86.484.7109.9170.9239.040.0°C/W
ψJTJunction-to-top characterization parameter60.862.79.313.717.20.6°C/W
ψJBJunction-to-board characterization parameter86.184.0109.3167.9238.340.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/an/an/an/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.