SN74LVC1G3157

ACTIVE

5-V, 2:1 (SPDT), 1-channel general-purpose analog switch

Top
5-V, 2:1 (SPDT), 1-channel general-purpose analog switch

SN74LVC1G3157

ACTIVE

Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 6 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 340 Operating temperature range (C) -40 to 125, -40 to 85 Features Break-before-make Input/output continuous current (Max) (mA) 128 Rating Catalog CON (Typ) (pF) 17.3 Supply current (Typ) (uA) 1 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .927 x 1.427 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 6 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1 X2SON (DTB) 6 1 mm² 0.8 x 1 open-in-new Find other Analog switches & muxes

Features

  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • 1.65-V to 5.5-V VCC Operation
  • Qualified For 125°C operation
  • Specified Break-Before-Make Switching
  • Rail-to-Rail Signal Handling
  • Operating Frequency Typically 340 MHz at Room Temperature
  • High Speed, Typically 0.5 ns
    (VCC = 3 V, CL = 50 pF)
  • Low ON-State Resistance, Typically ≉6 Ω
    (VCC = 4.5 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

All trademarks are the property of their respective owners.

open-in-new Find other Analog switches & muxes

Description

This single channel single-pole double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3157 device can handle both analog and digital signals. The SN74LVC1G3157 device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

open-in-new Find other Analog switches & muxes
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 33
Type Title Date
* Datasheet SN74LVC1G3157 Single-Pole Double-Throw Analog Switch datasheet (Rev. L) May 16, 2017
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application notes Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature SN74LVC1G3157 and SNS74LVC2G53 SPDT Analog Switches Jun. 12, 2003
User guides LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application notes Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application notes LVC Characterization Information Dec. 01, 1996
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application notes Live Insertion Oct. 01, 1996
User guides Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCEJ160.ZIP (98 KB) - HSpice Model
SIMULATION MODELS Download
SCEM322B.ZIP (59 KB) - IBIS Model
BILL OF MATERIALS (BOM) Download
SLVR350.PDF (241 KB)

Reference designs

Many TI reference designs include the SN74LVC1G3157 Use our reference design selection tool to review and identify designs that best match your application and parameters.

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options
SOT-5X3 (DRL) 6 View options
X2SON (DTB) 6 View options

Ordering & quality

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos