4 Revision History
Changes from Revision B (January 2016) to Revision C (December 2022)
- Updated the numbering format for tables, figures, and cross-references throughout the documentGo
- Updated thermals for PW package.Go
- Removed the Supports High-Speed Translation and added the
Balanced High-Drive CMOS Push-Pull Outputs sectionGo
Changes from Revision A (February 2007) to Revision B (January 2016)
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo