SLLS003F October   1985  – October 2022 SN75179B

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics: Driver
    5. 5.5 Switching Characteristics
    6. 5.6 Symbol Equivalent
    7. 5.7 Electrical Characteristics: Receiver
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) SOIC (D) PDIP (P) SOP (PS) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 109.5 84.3 °C/W

RθJC(top)

 Junction-to-case (top) thermal resistance 56.3 53.9 65.4

RθJB

 Junction-to-board thermal resistance 63.4 65.7 62.1
ψJT Junction-to-top characterization parameter 8.8 11.6 31.3
ψJB Junction-to-board characterization parameter 62.6 64.5 60.4
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.