SLLS121E August 1990 – April 2024 SN75ALS172A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DW (SOIC) | N (PDIP) | UNIT | |
---|---|---|---|---|
20-Pins | 16-Pins | |||
R θJA | Junction-to-ambient thermal resistance | 66.8 | 60.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.4 | 48.1 | °C/W |
R θJB | Junction-to-board thermal resistance | 39.7 | 40.6 | °C/W |
ψ JT | Junction-to-top characterization parameter | 8.9 | 27.5 | °C/W |
ψ JB | Junction-to-board characterization parameter | 39.0 | 40.3 | °C/W |
R θJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | °C/W |