SLLSEJ2G July   2015  – March 2020 SN65DP159 , SN75DP159

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      DP159 Mother Board Application Structure
      2.      DP159 Dongle Application Structure
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Electrical Characteristics
    6. 7.6  Differential Input Electrical Characteristics
    7. 7.7  HDMI and DVI TMDS Output Electrical Characteristics
    8. 7.8  AUX, DDC, and I2C Electrical Characteristics
    9. 7.9  HPD Electrical Characteristics
    10. 7.10 HDMI and DVI Main Link Switching Characteristics
    11. 7.11 AUX Switching Characteristics (Only for RGZ Package)
    12. 7.12 HPD Switching Characteristics
    13. 7.13 DDC and I2C Switching Characteristics
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Reset Implementation
      2. 9.3.2 Operation Timing
      3. 9.3.3 I2C-over-AUX to DDC Bridge (SNx5DP159 48-Pin Package Version Only)
      4. 9.3.4 Input Lane Swap and Polarity Working
      5. 9.3.5 Main Link Inputs
      6. 9.3.6 Main Link Inputs Debug Tools
      7. 9.3.7 Receiver Equalizer
      8. 9.3.8 Termination Impedance Control
      9. 9.3.9 TMDS Outputs
        1. 9.3.9.1 Pre-Emphasis/De-Emphasis
    4. 9.4 Device Functional Modes
      1. 9.4.1 Retimer Mode
      2. 9.4.2 Redriver Mode
      3. 9.4.3 DDC Training for HDMI2.0 Data Rate Monitor
      4. 9.4.4 DDC Functional Description
    5. 9.5 Register Maps
      1. 9.5.1 DP-HDMI Adaptor ID Buffer
      2. 9.5.2 Local I2C Interface Overview
      3. 9.5.3 I2C Control Behavior
      4. 9.5.4 I2C Control and Status Registers
        1. 9.5.4.1 Bit Access Tag Conventions
        2. 9.5.4.2 CSR Bit Field Definitions
          1. 9.5.4.2.1 ID Registers
          2. 9.5.4.2.2 Misc Control
          3. 9.5.4.2.3 HDMI Control
          4. 9.5.4.2.4 Equalization Control Register
          5. 9.5.4.2.5 EyeScan Control Register
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Use Case of SNx5DP159
      2. 10.1.2 DDC Pullup Resistors
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 System Example
      1. 10.3.1 Compliance Testing
  11. 11Power Supply Recommendations
    1. 11.1 Power Management
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.9 TMDS Outputs

An 1% precision resistor, 7.06-kΩ, is recommended to be connected from Vsadj pin to ground to allow the differential output swing to comply with TMDS signal levels. The differential output driver provides a typical 10-mA current sink capability when no source term is enabled, which provides a typical 500-mV voltage drop across a 50-Ω termination resistor. As compliance testing is system dependant this resistor value can be adjusted.

SN65DP159 SN75DP159 desc_TMDS_driv_SLLSEJ2.gifFigure 27. TMDS Driver and Termination Circuit

Referring to Figure 27, if both VCC (device supply) and AVCC (sink termination supply) are powered, the TMDS output signals are high impedance when OE = low. The normal operating condition is that both supplies are active. A total of 33-mW of power is consumed by the terminations independent of the OE logical selection. When AVCC is powered on, normal operation (OE controls output impedance) is resumed. When the power source of the device is off and the power source to termination is on, the IO(off) (output leakage current) specification ensures the leakage current is limited 45-μA or less.

The clock and data lanes VOD can be changed through I2C[4] (see VSWING_CLK and VSWING_DATA in Table 8 for details). Figure 3 shows the different output voltage based on different Vsadj resistor values.