SLASF32A December   2023  – October 2024 TAD5142

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
        3. 6.3.2.3 Left-Justified (LJ) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Analog Output Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 DAC Signal-Chain
        1. 6.3.6.1 Digital Interpolation Filters
          1. 6.3.6.1.1 Linear-phase filters
            1. 6.3.6.1.1.1 Sampling Rate: 8kHz or 7.35kHz
            2. 6.3.6.1.1.2 Sampling Rate: 16kHz or 14.7kHz
            3. 6.3.6.1.1.3 Sampling Rate: 24kHz or 22.05kHz
            4. 6.3.6.1.1.4 Sampling Rate: 32kHz or 29.4kHz
            5. 6.3.6.1.1.5 Sampling Rate: 48kHz or 44.1kHz
            6. 6.3.6.1.1.6 Sampling Rate: 96kHz or 88.2kHz
            7. 6.3.6.1.1.7 Sampling Rate: 192kHz or 176.4kHz
          2. 6.3.6.1.2 Low-latency Filters
            1. 6.3.6.1.2.1 Sampling Rate: 24kHz or 22.05kHz
            2. 6.3.6.1.2.2 Sampling Rate: 32kHz or 29.4kHz
            3. 6.3.6.1.2.3 Sampling Rate: 48kHz or 44.1kHz
            4. 6.3.6.1.2.4 Sampling Rate: 96kHz or 88.2kHz
            5. 6.3.6.1.2.5 Sampling Rate: 192kHz or 176.4kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD to VSS (thermal pad) –0.3 3.9 V
Supply voltage IOVDD to VSS (thermal pad) –0.3 3.9 V
Ground voltage differences VSSA to VSS (thermal pad) –0.3 0.3 V
Digital input voltage Digital input pins voltage to VSS (thermal pad) –0.3 IOVDD + 0.3 V
Temperature Functional ambient, TA –55 125 °C
Operating ambient, TA –40 125
Junction, TJ –40 150
Storage, Tstg –65 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.