SLASF32A December   2023  – October 2024 TAD5142

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
        3. 6.3.2.3 Left-Justified (LJ) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Analog Output Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 DAC Signal-Chain
        1. 6.3.6.1 Digital Interpolation Filters
          1. 6.3.6.1.1 Linear-phase filters
            1. 6.3.6.1.1.1 Sampling Rate: 8kHz or 7.35kHz
            2. 6.3.6.1.1.2 Sampling Rate: 16kHz or 14.7kHz
            3. 6.3.6.1.1.3 Sampling Rate: 24kHz or 22.05kHz
            4. 6.3.6.1.1.4 Sampling Rate: 32kHz or 29.4kHz
            5. 6.3.6.1.1.5 Sampling Rate: 48kHz or 44.1kHz
            6. 6.3.6.1.1.6 Sampling Rate: 96kHz or 88.2kHz
            7. 6.3.6.1.1.7 Sampling Rate: 192kHz or 176.4kHz
          2. 6.3.6.1.2 Low-latency Filters
            1. 6.3.6.1.2.1 Sampling Rate: 24kHz or 22.05kHz
            2. 6.3.6.1.2.2 Sampling Rate: 32kHz or 29.4kHz
            3. 6.3.6.1.2.3 Sampling Rate: 48kHz or 44.1kHz
            4. 6.3.6.1.2.4 Sampling Rate: 96kHz or 88.2kHz
            5. 6.3.6.1.2.5 Sampling Rate: 192kHz or 176.4kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Timing Requirements: TDM, I2S or LJ Interface

at TA = 25°C, IOVDD = 3.3V or 1.8V and 20pF load on all outputs (unless otherwise noted), see Figure 5-1 for timing diagram where DOUT refers to Daisy Chain Output when applicable
MIN NOM MAX UNIT
t(BCLK) BCLK period IOVDD = 1.8V 80 ns
IOVDD = 3.3V 40
tH(BCLK) BCLK high pulse duration(1) IOVDD = 1.8V 36 ns
IOVDD = 3.3V 18
tL(BCLK) BCLK low pulse duration(1) IOVDD = 1.8V 36 ns
IOVDD = 3.3V 18
tSU(FSYNC) FSYNC setup time IOVDD = 1.8V 8 ns
IOVDD = 3.3V 8
tHLD(FSYNC) FSYNC hold time IOVDD = 1.8V 8 ns
IOVDD = 3.3V 8
tSU(DIN) DIN setup time IOVDD = 1.8V 8 ns
IOVDD = 3.3V 8
tHLD(DIN) DIN hold time IOVDD = 1.8V 16 ns
IOVDD = 3.3V 8
tr(BCLK) BCLK rise time 10% - 90% rise time, IOVDD = 1.8V 10 ns
10% - 90% rise time, IOVDD = 3.3V 10
tf(BCLK) BCLK fall time 90% - 10% fall time, IOVDD = 1.8V 10 ns
90% - 10% fall time, IOVDD = 3.3V 10
(1) To meet the timing specifications, the BCLK minimum high or low pulse duration must be higher than 25ns, if the DOUT data line is latched on the opposite BCLK edge polarity from the one used by the device to transmit the DOUT data at IOVDD = 3.3V.