SLOSEA8 December   2024 TAS5815

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  8. 6 Typical Characteristics
    1. 6.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
    2. 6.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
    3. 6.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
    4. 6.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
      2. 7.3.2 Device Clocking
      3. 7.3.3 Serial Audio Port – Clock Rates
      4. 7.3.4 Serial Audio Port - Data Formats and Bit Depths
      5. 7.3.5 Clock Halt Auto-recovery
      6. 7.3.6 Sample Rate on the Fly Change
      7. 7.3.7 Digital Audio Processing
      8. 7.3.8 Class D Audio Amplifier
        1. 7.3.8.1 Speaker Amplifier Gain Select
    4. 7.4 Device Functional Modes
      1. 7.4.1 Software Control
      2. 7.4.2 Speaker Amplifier Operating Modes
        1. 7.4.2.1 BTL Mode
        2. 7.4.2.2 PBTL Mode
      3. 7.4.3 Low EMI Modes
        1. 7.4.3.1 Minimize EMI with Spread Spectrum
        2. 7.4.3.2 Minimize EMI with channel to channel phase shift
        3. 7.4.3.3 Minimize EMI with Multi-Devices PWM Phase Synchronization
      4. 7.4.4 Thermal Foldback
      5. 7.4.5 Device State Control
      6. 7.4.6 Device Modulation
        1. 7.4.6.1 BD Modulation
        2. 7.4.6.2 1SPW Modulation
        3. 7.4.6.3 Hybrid Modulation
      7. 7.4.7 Load Detect
        1. 7.4.7.1 Short Load Detect
        2. 7.4.7.2 Open Load Detect
    5. 7.5 Programming and Control
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 Target Address
        1. 7.5.2.1 Random Write
        2. 7.5.2.2 Random Read
        3. 7.5.2.3 Sequential Write
        4. 7.5.2.4 Sequential Read
        5. 7.5.2.5 DSP Memory Book, Page and BQ update
        6. 7.5.2.6 Example Use
        7. 7.5.2.7 Checksum
          1. 7.5.2.7.1 Cyclic Redundancy Check (CRC) Checksum
          2. 7.5.2.7.2 Exclusive or (XOR) Checksum
      3. 7.5.3 Control via Software
        1. 7.5.3.1 Startup Procedures
        2. 7.5.3.2 Shutdown Procedures
        3. 7.5.3.3 Protection and Monitoring
          1. 7.5.3.3.1 Overcurrent Shutdown (OCSD)
          2. 7.5.3.3.2 DC Detect
          3. 7.5.3.3.3 Device Over Temperature Protection
          4. 7.5.3.3.4 Over Voltage Protection
          5. 7.5.3.3.5 Under Voltage Protection
          6. 7.5.3.3.6 Clock Fault
  10. 8 Register Maps
    1. 8.1 CONTROL PORT Registers
  11. 9 Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Bootstrap Capacitors
      2. 9.1.2 Inductor Selections
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Application
      1. 9.2.1 2.0 (Stereo BTL) System
        1. 9.2.1.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step 1: Hardware Integration
        2. 9.2.2.2 Step 2: Speaker Tuning
        3. 9.2.2.3 Step 3: Software Integration
      3. 9.2.3 MONO (PBTL) System
        1. 9.2.3.1 Design Requirements
      4. 9.2.4 Advanced 2.1 System (Two TAS5815 Devices)
  12. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB footprint and Via Arrangement
          2. 11.1.3.2.2 Solder Stencil
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  15. 13Revision History
  16. 14Mechanical and Packaging Information
    1. 14.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TAS5815 PWP (TSSOP) Package, 28-Pin PadDown, Top View Figure 4-1 PWP (TSSOP) Package, 28-Pin PadDown, Top View
Table 4-1 Pin Functions For TSSOP28 Package
PIN TYPE(1) DESCRIPTION
NO. NAME
1 DGND P Digital ground
2 DVDD P 3.3-V/1.8-V digital power supply
3 ADR/FAULT DI/O A table of resistor value (Pull up/Down to DVDD/GND) will decide device I2C address.

After power up, this pin can be programmed by writing 1 to a register bit after Power up bit. In this mode, ADR/ FAULT is redefine as FAULT.
4 VR_DIG P Internally regulated 1.5-V digital supply voltage. This pin must not be used to drive external devices
5 DGND P Digital ground
6 LRCLK DI Input serial audio data left/right clock (sample rate clock)
7 SCLK DI Serial audio data clock (shift clock). SCLK is the serial audio port input data bit clock.
8 SDIN DI Serial audio data input. SDIN supports three discrete (stereo) data formats
9 SDOUT DO Serail audio data output, the source data can select as Pre-DSP or Post-DSP.
10 SDA DI/O I2C serial control data interface input/output
11 SCL DI I2C serial control clock input
12 PDN DI Power down, active-low. PDN sets the amplifier in Shutdown, turn off all internal regulators.
13 AVDD P Internally regulated 5 V analog power voltage. This pin must not be used to drive external devices.
14 AGND G Analog ground
15 PVDD P PVDD voltage input
16 PVDD P PVDD voltage input
17 OUT_B+ PO Positive pin for differential speaker amplifier output B+
18 BST_B+ P Connection point for the OUT_B+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B+
19 PGND G Ground reference for power device circuitry. Connect this pin to system ground
20 OUT_B- NO Negative pin for differential speaker amplifier output B-
21 BST_B- P Connection point for the OUT_B- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B-
22 BST_A- P Connection point for the OUT_A- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A-
23 OUT_A- NO Negative pin for differential speaker amplifier output A-
24 PGND G Ground reference for power device circuitry. Connect this pin to system ground
25 BST_A+ P Connection point for the OUT_A+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A+
26 OUT_A+ PO Positive pin for differential speaker amplifier output A+
27 PVDD P PVDD voltage input
28 PVDD P PVDD voltage input
PowerPADTM G Ground, connect to grounded heat sink for best system performance.
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), PO = Positive output, NO = Negative output, P = Power, G = Ground (0 V)